Thermal Management for LED Applications
  • Language: en
  • Pages: 551

Thermal Management for LED Applications

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

First European Biomedical Engineering Conference for Young Investigators
  • Language: en
  • Pages: 122

First European Biomedical Engineering Conference for Young Investigators

  • Type: Book
  • -
  • Published: 2015-05-28
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  • Publisher: Springer

This volume presents the proceedings of the first European Biomedical Engineering Conference for Young Investigators ENCY2015. It was in Budapest, from 28th to 30th May, 2015. The papers were assembled under the motto "Understanding complex living systems” and cover the topics sensors, image processing, bioinformatics, biomechanics, and modeling.

2005 21st IEEE Semiconductor Thermal Measurement and Management Symposium
  • Language: en
  • Pages: 360

2005 21st IEEE Semiconductor Thermal Measurement and Management Symposium

  • Type: Book
  • -
  • Published: 2005
  • -
  • Publisher: Unknown

None

EDN, Electrical Design News
  • Language: en

EDN, Electrical Design News

  • Type: Book
  • -
  • Published: 2002
  • -
  • Publisher: Unknown

None

Journal of Semicustom ICs
  • Language: en

Journal of Semicustom ICs

  • Type: Book
  • -
  • Published: 1989
  • -
  • Publisher: Unknown

None

Transactions of the ASME.
  • Language: en

Transactions of the ASME.

  • Type: Book
  • -
  • Published: 2004
  • -
  • Publisher: Unknown

None

Proceedings 1998, 35th Design Automation Conference
  • Language: en
  • Pages: 820

Proceedings 1998, 35th Design Automation Conference

None

2000 3rd Electronics Packaging Technology Conference
  • Language: en
  • Pages: 467

2000 3rd Electronics Packaging Technology Conference

Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

LexisNexis Corporate Affiliations
  • Language: en

LexisNexis Corporate Affiliations

  • Type: Book
  • -
  • Published: 2009
  • -
  • Publisher: Unknown

None

Advanced LEDs for solid state lighting
  • Language: en
  • Pages: 150